Cart (Loading....) | Create Account
Close category search window
 

Crumpling of Microstrip Antenna Array

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Qiang Bai ; Dept. if Electron. & Electr. Eng., Univ. of Sheffield, Sheffield, UK ; Rigelsford, J. ; Langley, R.

The performance of a 2 × 2 microstrip patch array under crumpling conditions is presented. The antenna array was manufactured on textile material, and three cases of crumpling resembling real applications are discussed. The performance of the individual patch elements correlate with the overall performance of the array. Frequency shifts of up to 6% are measured for the array when crumpled, the boresight gain is reduced by up to 6 dB with significant changes in directivity and efficiency, up to 20%. The overall efficiency for the textile array increases for crumpling in one plane but falls in the other.

Published in:

Antennas and Propagation, IEEE Transactions on  (Volume:61 ,  Issue: 9 )

Date of Publication:

Sept. 2013

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.