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Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

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3 Author(s)
Tzong-Lin Wu ; Dept. of Electr. Eng. & Grad. Inst. of Commun. Eng., Nat. Taiwan Univ., Taipei, Taiwan ; Buesink, F. ; Canavero, F.

This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.

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Electromagnetic Compatibility, IEEE Transactions on  (Volume:55 ,  Issue: 4 )