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Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield

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3 Author(s)
J. A. Stuart ; Dept. of Ind. Welding & Syst. Eng., Ohio State Univ., Columbus, OH, USA ; L. J. Turbini ; J. C. Ammons

Environmental legislation, technological advances and increasingly competitive global markets have led to a number of different product and process design choices for electronics assemblies. Decision tools to aid in the selection of a product and process design have been limited to qualitative methodologies. In addition, trade-offs between environmental impacts, yield, and reliability have not been analyzed. In this paper, electronic assembly product and process design alternatives are investigated using a quantitative methodology with life cycle considerations for environmental impacts. These impacts include energy usage, material consumption, waste generation, process yield, and product reliability

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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C  (Volume:20 ,  Issue: 4 )