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Pressure loss modeling for surface mounted cuboid-shaped packages in channel flow

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3 Author(s)
P. Teertstra ; Microelectron. Heat Transfer Lab., Waterloo Univ., Ont., Canada ; M. M. Yovanovich ; J. R. Culham

An analytical model is presented that predicts pressure loss for fully developed flow for air in a parallel plate channel with an array of uniformly-sized and spaced cuboid blocks on one wall. The model is intended for use in optimizing enclosure designs for air cooled electronics equipment containing arrays of printed circuit boards. Using a composite solution, based on the laminar and turbulent smooth wall channel limiting cases, the friction factor for periodic fully developed how can be calculated as a function of the array geometry and fluid velocity. The resulting model is applicable for a full range of Reynolds numbers, 1⩽ReDhˇ⩽100000 and accurately predicts the available measured values to within a 15% average difference

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:20 ,  Issue: 4 )