By Topic

Compact air-cooled heat sinks for power packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Aranyosi, A. ; Miskolc Univ., Hungary ; Bolle, L.M.R. ; Buyse, H.A.

The main findings of a theoretical and experimental work carried out in the development of compact air-cooled heat sinks tailored for spot-cooling of power packages are presented. After formulating the particular cooling task, the thermal issues and practical constraints of a compact heat exchanger design are matched to yield three structures, i.e., microchannel, woven wire screen and porous metal fiber, to be viable candidates. A simplified analytical model is developed to allow performance analyses and optimizations of microchannel and woven wire screen heat sinks operated in impingement mode. Based on the simulation results, five novel heat sinks are fabricated and tested. An experimental setup is built to investigate the effects of heat sink structure, mass-flow rate of air, power dissipation and mounting conditions on heat sink performance. In the measurements the source-gate voltage of the selected MOSFET is used as temperature sensitive electrical parameter (TSEP) to obtain the peak junction temperature. Dissipated base plate and volumetric heat fluxes of 15 W/cm2 and 5 W/cm3 are achieved, along with reasonable pressure and pumping power requirements as well as accompanying acoustic noise. Obtained results yield a fivefold enhancement in heat removal capability compared to traditional forced air-cooling schemes

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:20 ,  Issue: 4 )