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High power multichip modules employing the planar embedding technique and microchannel water heat sinks

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9 Author(s)
Hahn, R. ; Fraunhofer Inst. IZM, Berlin, Germany ; Kamp, A. ; Ginolas, A. ; Schmidt, M.
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This paper describes a novel packaging technology for high power multichip modules (MCMs). The work covers three areas: The fabrication of a multichip module which provides access to the die backside for heat removal, the development of high performance microchannel heat sinks with a matched CTE, as well as a low thermal resistivity assembling technology. The MCM is fabricated by means of the planar embedding technology. By planarizing the module backside a low thermal resistance between heat sink and dice can be accomplished simultaneously for all embedded components. A thermotest module of size 2×2 capable of a power dissipation of several hundred watts was fabricated. Thermal resistance values below 0.6 Kcm2/W at 50 W/cm2 chip flux have been achieved

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Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:20 ,  Issue: 4 )