By Topic

Study of the influence of an electric field on the liquid-vapor interface during film boiling of stagnant fluids

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Verplaetsen, F. ; Dept. of Mech. Eng., Katholieke Univ., Leuven, Belgium ; Berghmans, J.A.

This paper describes the influence of an electric field on the liquid-vapor interface during film boiling from a horizontal surface of stagnant fluids (pool boiling). An iterative solution technique is used to calculate the equilibrium shape of the liquid-vapor interface during film boiling. In each iteration step, a fourth-order Runge-Kutta integration technique is used to calculate the shape of the interface and a boundary element method is used to calculate the electric field. It is shown that an electric field elongates the vapor bubbles formed on this interface, and it is suggested that this effect has to be accounted for in the existing heat transfer models in order to describe the influence of an electric field on the heat transfer coefficient during film boiling

Published in:

Industry Applications, IEEE Transactions on  (Volume:33 ,  Issue: 6 )