By Topic

Prototype 250 GHz Bandwidth Chip to Chip Electrical Interconnect, Characterized With Ultrafast Optoelectronics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Jeong Sang Jo ; Division of Electrical and Electronics Engineering, Korea Maritime University, Busan, South Korea ; Tae-In Jeon ; Daniel R. Grischkowsky

We have connected two optoelectronic chips with air-spaced two-wire transmission lines and have observed essentially undistorted transmission of 1.8 ps (FWHM) electrical pulses over propagation distances up to 200 cm. The lines consist of two 0.4 mm (or 0.5 mm) diameter copper wires with centers separated by 1.0 mm. The air spaced two-wire lines show transform-limited TEM mode pulse propagation with very small group velocity dispersion (GVD), and relatively low attenuation. Our achieved performance with a power loss of 5.8 dB/m approaches that needed for mm-wave and THz interconnects. The coupling was enabled by two tungsten probes with 1 μm diameter tips in near-contact (5 μm gap) with the coplanar transmission lines on the transmitting and receiving optoelectronic chips. The air spaced two-wire line's relatively small, measured pulse amplitude attenuation coefficient was 1.31 times larger than the theoretical prediction for the TEM mode. This discrepancy is considered to be primarily due to reduction of the Cu conductivity in the THz skin-depth layer.

Published in:

IEEE Transactions on Terahertz Science and Technology  (Volume:3 ,  Issue: 4 )