Automated removal and replacement of through-hole components in robotic rework

The need for computer controlled, fully automated rework stations has increased recently due to potential difficulties involved in manual rework of printed circuit board assemblies (PCBAs). An autonomous fully-automated robotic rework cell has been developed for the rework of TH and SM components. This paper concentrates on TH component removal and replacement issues. After a brief introduction to TH rework technology and overall cell structure, it draws attention to the main issues of component removal with regard to gripping and heating. Two multifunctional grippers that are unique in their design are presented as a solution for clinched TH component removals. Since heat is the major issue in the process, dwell times for component removal and replacement are given based on a full scale experimental study. Results of automated TH rework evaluations include the success of leg cutting, spray fluxing, removal and replacement of components.