By Topic

In-situ measurements of surface mount IC package deformations during reflow soldering

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
M. G. Pecht ; CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA ; A. Govind

In this study, a real-time probe was developed for in-process measurement and recording of package deformations during simulated solder reflow. The objective was to obtain fundamental insights into the stresses seen by the package during reflow, to guide package design, modeling, material selection, and process improvement efforts. Experiments were conducted to obtain temperature and time resolved deformation signatures of packages due to the applied reflow profile. The occurrence of delamination and cracking and the reflow parameters associated with its initiation were identified using the deformation plots and the observations were verified by post-reflow inspection using scanning acoustic microscopy. Absorbed moisture in the package was found to play a role in package deformations beyond 90°C, with an increased rate of deformations beyond approximately 138°C. Partial reflow simulation experiments revealed that these deformations were not caused by the initiation and growth of interfacial delaminations, but rather to moisture-induced swelling and thermal expansion effects

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C  (Volume:20 ,  Issue: 3 )