By Topic

Manufacturing concerns when soldering with gold plated component leads or circuit board pads

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ferguson, M.E. ; IBM Corp., Charlotte, NC, USA ; Fieselman, C.D. ; Elkins, M.A.

When manufacturing with either gold plated component leads or printed circuit board pads, one must be concerned with the amount of gold in the solder joint. Gold dissolves quickly in tin/lead solders, forming weak, brittle compounds, that when in high enough concentrations, adversely affect the solder joint fatigue life. This paper discusses the effects of gold in tin/lead solder, a qualification test with varying solder paste volumes, calculations for percent Au concentrations, a reliability test and its results, and suggested process controls or manufacturing safeguards

Published in:

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on  (Volume:20 ,  Issue: 3 )