By Topic

Solder paste print qualification using laser triangulation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
R. R. Lathrop ; Heraeus Cermalloy Inc., West Conshohocken, PA, USA

A method for determining the printability of a solder paste has been developed using laser triangulation based sensor hardware. The noncontact attribute of this measurement method is ideal for wet print measurements. The effect on material printability of both formulation and process elements are discussed. Results indicate that powder size has a definite and significant effect on the printability of the solder paste for 20 mil pitch applications. Bare board outer layer anomalies are characterized by surface scans and virtual cross sections

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C  (Volume:20 ,  Issue: 3 )