Cart (Loading....) | Create Account
Close category search window
 

A CMOS integrated MEMS capacitive pressure sensor design in a 3D SiGeMEMS process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Sundararajan, A.D. ; Center for Res. in Analog & VLSI Microsyst. dEsign, Massey Univ., Auckland, New Zealand ; Rezaul Hasan, S.M.

A novel CMOS integrated Micro-Electro-Mechanical capacitive pressure sensor in SiGeMEMS (Silicon Germanium Micro-Electro-Mechanical System) process is designed and analyzed. Excellent mechanical stress-strain behavior of Polycrystalline Silicon Germanium (Poly-SiGe) is utilized effectively in this MEMS design to characterize the structure of the pressure sensor diaphragm element. The edge clamped elliptic structured diaphragm uses semi-major axis clamp springs to yield high sensitivity, large dynamic range and good linearity. Integrated on-chip signal conditioning circuit in 0.18μm TSMC CMOS technology (forming the host substrate base for the SiGe MEMS) is also implemented to achieve a high gain of 100.5dB for the MEMS sensor. A high sensitivity of 4.65mV/V/hPa, with a non linearity of less than 1% for the full scale range of applied pressure load is achieved. The diaphragm with a wide dynamic range of 10hPa - 1000hPa stacked on top of the CMOS circuitry, effectively reduces the combined sensor+conditioning implementation area of the intelligent sensor chip.

Published in:

Mechatronics and Machine Vision in Practice (M2VIP), 2012 19th International Conference

Date of Conference:

28-30 Nov. 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.