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Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing

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3 Author(s)
Kandalaft, N. ; Electr. Eng. Dept., Univ. of Windsor, Windsor, ON, Canada ; Rashidzadeh, R. ; Ahmadi, M.

Testing the integrity of interconnects realized by through silicon vias (TSVs) in 3-D integrated circuits (3-D IC) is considered a challenging task. TSVs are excessively small and fragile for current probe technology. In this paper, a new spring-type probe using microelectromechanical systems (MEMS) technology is presented. The implemented MEMS probe supports the required pitch for TSV direct probing and minimizes the undesired scrub marks on TSV surface. Simulation results indicate that the implemented MEMS probe can operate at the gigahertz frequency range without significant test signal degradation.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:32 ,  Issue: 4 )

Date of Publication:

April 2013

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