By Topic

A 3-D Split Manufacturing Approach to Trustworthy System Development

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Jonathan Valamehr ; Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA ; Timothy Sherwood ; Ryan Kastner ; David Marangoni-Simonsen
more authors

Securing the supply chain of integrated circuits is of utmost importance to computer security. In addition to counterfeit microelectronics, the theft or malicious modification of designs in the foundry can result in catastrophic damage to critical systems and large projects. In this letter, we describe a 3-D architecture that splits a design into two separate tiers: one tier that contains critical security functions is manufactured in a trusted foundry; another tier is manufactured in an unsecured foundry. We argue that a split manufacturing approach to hardware trust based on 3-D integration is viable and provides several advantages over other approaches.

Published in:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems  (Volume:32 ,  Issue: 4 )