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A 22nm SoC platform technology featuring 3-D tri-gate and high-k/metal gate, optimized for ultra low power, high performance and high density SoC applications

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23 Author(s)
Jan, C.-H. ; Logic Technol. Dev., Intel Corp., Hillsboro, OR, USA ; Bhattacharya, U. ; Brain, R. ; Choi, S.-J.
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A leading edge 22nm 3-D tri-gate transistor technology has been optimized for low power SoC products for the first time. Low standby power and high voltage transistors exploiting the superior short channel control, <; 65mV/dec subthreshold slope and <;40mV DIBL, of the Tri-Gate architecture have been fabricated concurrently with high speed logic transistors in a single SoC chip to achieve industry leading drive currents at record low leakage levels. NMOS/PMOS Idsat=0.41/0.37mA/um at 30pA/um Ioff, 0.75V, were used to build a low standby power 380Mb SRAM capable of operating at 2.6GHz with 10pA/cell standby leakages. This technology offers mix-and-match flexibility of transistor types, high-density interconnect stacks, and RF/mixed-signal features for leadership in mobile, handheld, wireless and embedded SoC products.

Published in:

Electron Devices Meeting (IEDM), 2012 IEEE International

Date of Conference:

10-13 Dec. 2012