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A Review of Haptic Feedback Teleoperation Systems for Micromanipulation and Microassembly

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2 Author(s)
Aude Bolopion ; Institut FEMTO-ST, UFC, ENSMM, UTBM, Besançon, France ; Stéphane Régnier

This paper presents a review of the major haptic feedback teleoperation systems for micromanipulation. During the last decade, the handling of micrometer-sized objects has become a critical issue. Fields of application from material science to electronics demonstrate an urgent need for intuitive and flexible manipulation systems able to deal with small-scale industrial projects and assembly tasks. Two main approaches have been considered: fully automated tasks and manual operation. The first one require fully pre determined tasks, while the later necessitates highly trained operators. To overcome these issues the use of haptic feedback teleoperation where the user manipulates the tool through a joystick whilst feeling a force feedback, appears to be a promising solution as it allows high intuitiveness and flexibility. Major advances have been achieved during this last decade, starting with systems that enable the operator to feel the substrate topology, to the current state-of-the-art where 3D haptic feedback is provided to aid manipulation tasks. This paper details the major achievements and the solutions that have been developed to propose 3D haptic feedback for tools that often lack 3D force measurements. The use of virtual reality to enhance the immersion is also addressed. The strategies developed provide haptic feedback teleoperation systems with a high degree of assistance and for a wide range of micromanipulation tools. Based on this expertise on haptic for micromanipulation and virtual reality assistance it is now possible to propose microassembly systems for objects as small as 1 to 10 micrometers. This is a mature field and will benefit small-scale industrial projects where precision and flexibility in microassembly are required.

Published in:

IEEE Transactions on Automation Science and Engineering  (Volume:10 ,  Issue: 3 )