By Topic

Miniature hybrid microwave ICs using a novel thin-film technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Eda, K. ; Matsushita Electr. Ind. Co. Ltd., Osaka, Japan ; Miwa, T. ; Taguchi, Y. ; Uwano, T.

A novel thin-film technology for miniature hybrid microwave ICs is presented. All passive components, such as resistors and capacitors, are fully integrated on ordinary alumina ceramic substrates using the thin-film technology with very high yield. The numbers of parts and wiring processes were significantly reduced. This technology was applied to the fabrication of Ku-band solid-state power amplifiers. This thin-film technology offers the following advantages: (1) a very high yield fabrication process for thin-film capacitors having excellent electrical characteristics in the gigahertz range (ε=3.6, Q=230 at 12 GHz) and reliability; (2) two kinds of thin-film resistors having different temperature coefficients of resistivity (TCRs) and a lift-off process to integrate them with thin-film capacitors; and (3) a matching method using the thin-film capacitor

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:38 ,  Issue: 12 )