By Topic

Buried double bondwires for microwave hermetic packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Sung-Jin Kim ; Sch. of Electr. & Electron. Eng., Ajou Univ., Suwon ; Hai-young Lee

Double bondwires buried in dielectric material are proposed for high frequency hermetic packages and characterised experimentally and theoretically up to 30 GHz. These buried bondwires show a significant reduction in parasitic inductance (0.1 nH) and superior impedance matching to 50 Ω

Published in:

Electronics Letters  (Volume:33 ,  Issue: 25 )