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Buried double bondwires for microwave hermetic packages

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2 Author(s)
Sung-Jin Kim ; Sch. of Electr. & Electron. Eng., Ajou Univ., Suwon ; Hai-Young Lee

Double bondwires buried in dielectric material are proposed for high frequency hermetic packages and characterised experimentally and theoretically up to 30 GHz. These buried bondwires show a significant reduction in parasitic inductance (0.1 nH) and superior impedance matching to 50 Ω

Published in:

Electronics Letters  (Volume:33 ,  Issue: 25 )