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Through the Looking Glass II?Part 1 of 2: Trend Tracking for ISSCC 2013 [ISSCC Trends]

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3 Author(s)
Smith, K. ; University of Toronto, Canada ; Wang, A. ; Fujino, L.

What follows is a sampling of recent analyses and predictions by selected subcommittees of the International Solid-State Circuits Conference (ISSCC) 2013: Analog, Data Converters, RF, Wireless, and Wireline.

Published in:

Solid-State Circuits Magazine, IEEE  (Volume:5 ,  Issue: 1 )