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Millimeter-Wave Horn-Type Antenna-in-Package Solution Fabricated in a Teflon-Based Multilayer PCB Technology

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3 Author(s)
Enayati, A. ; Inter-Univ. Microelectron. Center (IMEC), Leuven, Belgium ; Vandenbosch, G.A.E. ; Deraedt, W.

An antenna-in-package solution is introduced for millimeter-wave applications. The solution is implemented in an asymmetric PCB technology incorporating 4 laminates of a Teflon-based and one laminate of a Ceramic-based material. A Horn-like element embedded in the PCB technology is designed and manufactured. The simulated and measured return losses are better than 10 dB in the frequency band 55-68 GHz, which makes the element suitable to be used for 60 GHz multi-Gb/Sec applications. The antenna element also provides 6 dB of gain with a ripple less that 0.5 dB from 53 GHz to 60 GHz. Moreover, 3 different arrays have been designed using the same Horn-like antenna as the radiating element. The simulated and measured radiation characteristics of all the antennas are investigated at different frequencies. It is shown that the antenna element is capable of being arrayed for applications where non-line-of-sight communication is needed or multi-path spatial diversity techniques are to be implemented.

Published in:

Antennas and Propagation, IEEE Transactions on  (Volume:61 ,  Issue: 4 )