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This study proposes a novel silicon-based LED packaging module with a photo-sensing element. The photosensitive component and the base structure of LED die were directly fabricated on the silicon wafer by microfabrication processes with ion doping and inductively coupled plasma etching processes, respectively, to achieve miniaturization, integration, and low-cost smart LED packaging modules. The subsequent integration of specific heat sinks and thin-shell optical caps facilitates a decrease in operating temperatures and improves sensitivity. Experimental result shows the sensitivity of the sensing module with a chip size of 1×1×0.15 cm3 was 3.1 μA/nt. The operating temperatures of the LED die and photosensitive region were maintained below 70°C and 47°C, respectively, when the input current of LED was 0.3 A.