By Topic

Next generation electroplating technology for high planarity, minimum surface deposition microvia filling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
Ming-Yao Yen ; Dow Electron. Mater., Dow Chem. Co., Taoyuan Hsien, Taiwan ; Ming-Hung Chiang ; Hsu-Hsin Tai ; Hsien-Chang Chen
more authors

The combination of specialized equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling. A new, insoluble anode, DC microvia fill system is now available for high volume manufacturing (HVM), offering additional operating flexibility and end user preference.

Published in:

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International

Date of Conference:

24-26 Oct. 2012