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Room temperature debonding — An enabling technology for TSV and 3D integration

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5 Author(s)
Matthias, T. ; EV Group, St. Florian am Inn, Austria ; Pauzenberger, G. ; Burggraf, J. ; Burgstaller, D.
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ZoneBONDTM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBONDTM Open Platform enables a versatile supply chain with multiple adhesive suppliers.

Published in:

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International

Date of Conference:

24-26 Oct. 2012