By Topic

Improvements in Silicon Oxide Dielectric Loss for Superconducting Microwave Detector Circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

15 Author(s)
Dale Li ; Quantum Electronics and Photonics Division, National Institute of Standards and Technology, Boulder, CO, USA ; J. Gao ; J. E. Austermann ; J. A. Beall
more authors

Dielectric loss in low-temperature superconducting integrated circuits can cause lower overall efficiency, particularly in the 90 to 220 GHz regime. We present a method to tune the dielectric loss for silicon oxide deposited by plasma-enhanced chemical-vapor deposition at ambient temperatures. Deposition in an environment with a higher silane-to-oxygen ratio produces silicon oxide films with a lower loss-tangent and a slightly higher optical index of refraction, while contributing no appreciable change in film stress. We measured the dielectric loss by fabricating a series of Nb-SiOx-Nb microstrip resonators in the frequency range of 6 to 9 GHz and comparing their temperature dependence to a model of parasitic two-level-system fluctuators. The dielectric loss-tangent of silicon oxide was improved from 6 ×10-3 for stoichiometric silicon dioxide to 2 ×10-3 for a more silicon-rich silicon oxide. We present details of the fabrication process and measurements of microstrip resonators.

Published in:

IEEE Transactions on Applied Superconductivity  (Volume:23 ,  Issue: 3 )