Scheduled System Maintenance:
On May 6th, single article purchases and IEEE account management will be unavailable from 8:00 AM - 5:00 PM ET (12:00 - 21:00 UTC). We apologize for the inconvenience.
By Topic

Non-planar surface bonding with spray-coated SU-8 as adhesive layer

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Nannan Li ; Nat. Key Lab. on Micro/Nano Fabrication Technol., Inst. of Microelectron., Peking Univ., Beijing, China ; Shuwei He ; Qiancheng Zhao ; Shibin Zhang
more authors

In this study, substrates with a large topography were aligned and bonded, and a spray-coated SU-8 was employed as the adhesive layer between two complementary non-planar surfaces. Both wafer-level and chip-level bonding were carried out with an alignment tolerance of 5 m. The bonding pairs exhibited enhanced tensile strength and shearing strength compared to that of the planar surface bonding, which was influenced by the gap between the bonding surfaces. This technology meets the requirements of the wafer-level three-dimensional structure transfer and opens up possibilities for manufacturing more complicated microelectromechanical systems devices.

Published in:

Micro & Nano Letters, IET  (Volume:7 ,  Issue: 12 )