By Topic

Nickel–chromium alloy piezoresistive pressure sensor using eutectic bonding

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Lidong Du ; State Key Lab. of Transducer Technol., Inst. of Electron., Beijing, China ; Zhan Zhao ; Li Xiao ; Zhen Fang
more authors

A nickel-chromium (Ni-Cr) piezoresistive pressure sensor is presented, which has the advantages of low-cost and easy fabrication processes. In the designed sensor, Ni-Cr alloy (80:20-wt-), which can be fabricated using simple processes, is used as the strain-detecting material with a smaller but acceptable gauge factor. Eutectic-bonding technology, based on silver-tin (Ag-Sn) alloy, which contains 3.5-wt- Ag and has 20--m thickness, is used as an alternative and easy bonding choice to complete the vacuum package. Normally, Ag-Sn alloy is mostly obtained by the electrochemical deposition method. However, here the Ag-Sn solder film is directly used as a bonding material. It reduces the fabrication difficulty of eutectic bonding of the proposed pressure sensor. By studying the processes of annealing of Ni-Cr fabrication and eutectic bonding with Ag-Sn, the authors complete the alloy piezoresistive atmosphere pressure sensor. Bonding quality is evaluated by inspection through the deflection of a diaphragm of silicon with more than 95- of the area successfully bonded. The pressure-voltage characteristic test results suggest a precision within 0.3- in square fitting. The temperature coefficient offset is 620-ppm/(-C free space optic (FSO)).

Published in:

Micro & Nano Letters, IET  (Volume:7 ,  Issue: 12 )