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Browse Journals & Magazines > Microwave Theory and Techniqu ...> Volume:45 Issue:10 Help

Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling

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1 Author(s)
Pillai, E.R. ; Div. of Microelectron., IBM Corp., Hopewell Junction, NY, USA

Large-scale crosstalk at vias and poor via electrical performance are major drawbacks in state-of-the-art high-frequency multilayer first- or second-level integrated-circuit/monolithic-microwave integrated-circuit (IC/MMIC) packages. The coax via design modeled in this paper breaks new ground in achieving more than 30-dB ultrawide-band crosstalk reduction and providing an enhanced impedance match

Published in:
Microwave Theory and Techniques, IEEE Transactions on  (Volume:45 ,  Issue: 10 )

Date of Publication: Oct 1997

Page(s):
1981 - 1985
ISSN :
0018-9480
INSPEC Accession Number:
5726822
Digital Object Identifier :
10.1109/22.641808
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Oct 1997
Sponsored by :
IEEE Microwave Theory and Techniques Society

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