A package characterization technique using coplanar waveguide (CPW) probes and line-reflect-match (LRM) calibrations for surface-mountable packages is presented. CPW-to-package adapters (CPA) are fabricated on alumina substrates to mount and measure the high-frequency response of plastic packages. Offset CPA standards in conjunction with an LRM calibration are used to de-embed the response of the adapters from the measured S-parameters. Application of this method is demonstrated by characterizing and modeling surface-mount microwave plastic packages
Published in:
Microwave Theory and Techniques, IEEE Transactions on
(Volume:45
,
Issue:
10
)
Date of Publication: Oct 1997