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Development of microwave package models utilizing on-wafer characterization techniques

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4 Author(s)
Chun, C. ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Anh-Vu Pham ; Laskar, J. ; Hutchison, Brian

A package characterization technique using coplanar waveguide (CPW) probes and line-reflect-match (LRM) calibrations for surface-mountable packages is presented. CPW-to-package adapters (CPA) are fabricated on alumina substrates to mount and measure the high-frequency response of plastic packages. Offset CPA standards in conjunction with an LRM calibration are used to de-embed the response of the adapters from the measured S-parameters. Application of this method is demonstrated by characterizing and modeling surface-mount microwave plastic packages

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:45 ,  Issue: 10 )