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Microwave-circuit modeling of high lead-count plastic packages

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2 Author(s)
Jackson, R.W. ; Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA ; Rakshit, S.

A microwave-circuit model topology for elevated-paddle surface-mount packages is extended to packages with high-lead counts. Features such as irregular lead structures, long wirebonds, smaller pitches, and finite-lead thickness are all examined. The modeling technique is applied to a shrink small-outline package (SSOP-24) with the results compared to measurements of a 25 times size scale model. The circuit model is used to investigate the performance of a matched transition

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:45 ,  Issue: 10 )