Scheduled System Maintenance:
On May 6th, system maintenance will take place from 8:00 AM - 12:00 PM ET (12:00 - 16:00 UTC). During this time, there may be intermittent impact on performance. We apologize for the inconvenience.
By Topic

Microwave-circuit modeling of high lead-count plastic packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
2 Author(s)
Jackson, R.W. ; Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA ; Rakshit, S.

A microwave-circuit model topology for elevated-paddle surface-mount packages is extended to packages with high-lead counts. Features such as irregular lead structures, long wirebonds, smaller pitches, and finite-lead thickness are all examined. The modeling technique is applied to a shrink small-outline package (SSOP-24) with the results compared to measurements of a 25 times size scale model. The circuit model is used to investigate the performance of a matched transition

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:45 ,  Issue: 10 )