Cart (Loading....) | Create Account
Close category search window
 

Study on the pressurized underfill encapsulation of flip chips

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Han, S. ; Cornell Univ., Ithaca, NY, USA ; Wang, K.K.

Flip-chip technology generally requires encapsulation of the solder joints to reduce the loads on such joints during thermal excursions. At present, the encapsulation process by dispensing constitutes the primary obstacle to widespread acceptance and implementation of flip-chip technology because of the long process times involved and the subsequent reliability and reparability problem. A new process to encapsulate flip-chips has been developed. This process uses a special mold to surround the chip to be encapsulated and injects the encapsulation material at elevated pressure. The experimental results show that the pressurized encapsulation process reduces the fill time (by as much as a factor of 1000), is able to perform the encapsulation at room temperature, fills the cavity completely without any voids and increases the capability of handling highly viscous encapsulants (1000 times more viscous than current commercial encapsulants) relative to the customary dispensing process for the particular case used in the current experiment

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:20 ,  Issue: 4 )

Date of Publication:

Nov 1997

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.