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Diaphragm-based microsystems using thin film silicon carbide

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3 Author(s)
Zorman, C.A. ; Dept. of Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA ; Barnes, A.C. ; Feng, P.X.

Silicon carbide (SiC) is a leading material for both semiconductor devices and harsh environment micro- and nano-electromechanical systems (MEMS/NEMS) due to a combination of exceptional electrical, mechanical and chemical properties. SiC is also an excellent structural material for micromechanical transducers because of its high Young's modulus and mechanical strength. Suspended thin film diaphragms have been used in a wide range of applications, ranging from fundamental materials characterization to structural elements in high temperature pressure transducers. This paper reviews some of our efforts to develop SiC as a structural material for diaphragm-based MEMS, highlighting recent advances by our group in developing these structures for use in electromechanical microsensors and microactuators.

Published in:

Sensors, 2012 IEEE

Date of Conference:

28-31 Oct. 2012