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This paper presents the studies on the influences of thermally induced package effects on radio frequency (RF) characteristics of surface acoustic wave (SAW) devices. A packaged SAW resonator is modeled based on finite element method (FEM), and surface deformation of the chip substrate during packaging process is analyzed. RF characteristics of the device are simulated and compared before and after packaging. Experiments are conducted to validate the simulation and analyses results. Both the simulation and experiments show a frequency shift of dozens of kHz between naked and packaged device.