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In this paper, the 3T1D-DRAM cell based on FinFET devices is studied as an alternative to the bulk one. We observe an improvement in its behavior when IG and SG FinFETs are properly mixed, since together they provide a relevant increase in the memory circuit retention time. Moreover, our FinFET cell shows larger variability robustness, better performance at low supply voltage, and higher tolerance to elevated temperatures.
Device and Materials Reliability, IEEE Transactions on (Volume:13 , Issue: 1 )
Date of Publication: March 2013