Skip to Main Content
In this paper, the system on chip (SOC) and system in package (SiP) are discussed as two main approaches for system integration. The system on package (SOP) is introduced with the discussion of the integrated passive device (IPD). IPD based on silicon with high resistance is investigated and the SOP using silicon-based IPD is analyzed. It is found that the silicon-based IPD is a good candidate for the system integration, especially in radio frequency (RF) applications.