Skip to Main Content
In CFL lighting applications one of the main topics to address is the thermal situation of the driver electronics. With a relative high local ambient temperature the package for the CFL driver IC needs to be optimal designed for cost, size and thermal behavior. For the CFL application a compact thermal model was made and thermal measurements were done, showing a clear relation between used package technology and maximum CFL output power. The results can be used for optimal co-design of new CFL IC's and their packages.