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A scalable electrical characterization method for inter-strata interconnects in 3-D ICs

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2 Author(s)
Tian Xia ; School of Engineering, University of Vermont ; Guoan Wang

This paper presents an analytical modeling method for characterizing the vertical interconnects in 3D ICs. In the model, all interconnection components, including micro-bump, TSV and RDL are firstly characterized with the frequency dependent skin effect into consideration. Then the scalable interconnect ABCD matrices are developed. The component's dimensional effects on electrical properties, such as insertion loss, interconnect delay and input impedance are investigated.

Published in:

SOC Conference (SOCC), 2012 IEEE International

Date of Conference:

12-14 Sept. 2012