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A Low Cost Multi-chip Module Using Fine Line Thick Film And Solder Ball Bump Interconnection Methods

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4 Author(s)
Segawa, M. ; Saito, Y. ; Ogashiwa, T. ; Akimoto, H.

First Page of the Article

Published in:
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Date of Conference: 9-11 Jun 1993

Page(s):
370 - 373
Print ISBN:
0-7803-1432-8
Digital Object Identifier :
10.1109/IEMT.1993.639810
Product Type:
Conference Publications

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