Scheduled System Maintenance:
Some services will be unavailable Sunday, March 29th through Monday, March 30th. We apologize for the inconvenience.
By Topic

Fabrication and Test of 90-mm \hbox {Nb}_{3}\hbox {Sn} Quadrupole Coil Impregnated With MATRIMID—Bismaleimide Based Material

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

11 Author(s)
Bossert, R. ; Fermi Nat. Accel. Lab., Batavia, IL, USA ; Krave, S. ; Ambrosio, G. ; Andreev, N.
more authors

The traditional fabrication process used for Nb3Sn accelerator magnets involves reaction of the coils at high temperature and impregnation with epoxy to restore the electrical and mechanical properties of the insulation. The traditional epoxy offers adequate structural and electrical properties, but has low radiation strength, limiting the lifetime of magnets operating in severe radiation environments. This paper presents the results of a study in which the traditional epoxy was replaced with Matrimid 5292 as a coil impregnation material. Test stacks of cable were fabricated and impregnated with epoxy and Matrimid. Electrical, structural and thermal properties were measured and compared. A 90-mm-bore, 1-meter-long Nb3Sn quadrupole coil made of RRP 54/61 strand was fabricated, reacted, impregnated with Matrimid, and tested in a single coil test structure (quadrupole magnetic mirror). Test results are compared with the results for similar coils impregnated with epoxy.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:23 ,  Issue: 3 )