Cart (Loading....) | Create Account
Close category search window

Note: Radiofrequency scanning probe microscopy using vertically oriented cantilevers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Valdre, G. ; Department of Earth and Geo-Environmental Sciences, Alma Mater Studiorum - University of Bologna, Bologna 40126, Italy ; Moro, D.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

We present a simple method, based on the modification of a widespread atomic force microscope, that allows the simultaneous acquisition of the sample topography and RF spectra at the nanoscale minimizing the parasitic capacitance of the cantilever. We used a microcantilever set with its long axis perpendicular to the specimen surface and connected to a vector network analyzer (RF range 100 kHz–8.5 GHz) to measure RF impedance signal variations at the cantilever apex-sample interface. The RF impedance signal was found highly sensitive to very short probe-to-sample distances (<50 nm) and to material properties at the interface.

Published in:

Review of Scientific Instruments  (Volume:83 ,  Issue: 12 )

Date of Publication:

Dec 2012

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.