Referenced Items are not available for this document.
An investigation of O2, Ar and Ar/H2 plasma cleaning was carried out on PBGA substrates to study its effects on surface cleanliness, wire bondability and moulding compound/solder mask adhesion. Optimisation of the plasma parameters was achieved using the contact angle method and verified by AES, XPS and wedge pull test. Generally, it was noted that the wedge bond quality and moisture sensitivity of a 225 I/O PBGA were improved after plasma cleaning. Furthermore, AFM characterization revealed that the solder mask has undergone plasma induced surface modification. Cross-contamination of Au and F traces on the solder mask which has occurred during plasma cleaning was analysed by XPS. Results from this study have demonstrated the benefits and consequences of plasma cleaning for PBGA
Published in:
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Date of Conference: 21-25 Jul 1997
- Page(s):
- 50 - 55
- Meeting Date :
- 21 Jul 1997-25 Jul 1997
- Print ISBN:
- 0-7803-3985-1
- INSPEC Accession Number:
- 5816234
- Digital Object Identifier :
- 10.1109/IPFA.1997.638120
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
