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Microstructural and compositional failure analysis of Cr-CrCu-Cu thin films for ball grid array (BGA) applications

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3 Author(s)
Na Zhang ; Appl. Lab., EDAX Int., Mahwah, NJ, USA ; McNicholas, M. ; Colvin, N.

A PVD Cr-CrCu-Cu metal scheme for flip chip applications was investigated varying the conditions of deposition power and temperature, and film thickness. The thin film stress and resistivity of the Cr-CrCu-Cu multilayers and the effect of film and thermal cycle reliability were studied. Thermal cycle reliability results proved to be a function of both the CrCu alloy and the Cu overlayer thickness. Analytical Electron Microscopy (AEM) results support the diffusion barrier relationship of CrCu layer

Published in:

Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on

Date of Conference:

21-25 Jul 1997