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An Efficient Metal-Core Printed Circuit Board With a Copper-Filled Through (Blind) Hole for Light-Emitting Diodes

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4 Author(s)
Je-Yi Wu ; Dept. of Chem. Eng., Nat. Chung Hsing Univ., Taichung, Taiwan ; Chih-Ming Chen ; Ray-Hua Horng ; Dong-Sing Wuu

A Cu-filled through (blind) hole was formed in a metal-core printed circuit board (MCPCB) by drilling a hole underneath the chip pad, followed by hole filling using copper electroplating. This Cu-filled through (blind) hole acts as a superior heat-dissipation route, which directly and efficiently removes the heat generated by the light-emitting diode (LED) chip. Compared with a conventional MCPCB, the MCPCB with a Cu-filled through (blind) hole significantly reduces the peak surface temperature of the LED chip from 46 °C to 39 °C and the total thermal resistance from 8.9 to 2.8 K/W.

Published in:

Electron Device Letters, IEEE  (Volume:34 ,  Issue: 1 )