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Silicon-Embedded Receiving Coil for High-Efficiency Wireless Power Transfer to Implantable Biomedical ICs

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5 Author(s)
Rongxiang Wu ; Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong ; Salahuddin Raju ; Mansun Chan ; Johnny K. O. Sin
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In this letter, a silicon-embedded receiving coil is designed and fabricated for high-efficiency wireless power transfer to implantable biomedical ICs. The 4.5 mm × 4.5 mm embedded receiving coil achieved a large inductance of 4 μH and a high peak quality factor of 20 at 2.8 MHz. Measurement results of an inductive power link using the embedded receiving coil and a conventional printed-circuit-board transmitting coil (2 cm × 2 cm) demonstrated peak voltage gains of 0.84 and 0.24 and peak efficiency values of 30% and 4.3% for separation distances of 5 and 12 mm, respectively. This is the best reported wireless power transmission efficiency for separation distance similar to the implant chip size.

Published in:

IEEE Electron Device Letters  (Volume:34 ,  Issue: 1 )