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VAX 9000 packaging-the multi chip unit

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2 Author(s)
Marshall, D.E. ; Digital Equipment Corp., Boxborough, MA, USA ; McElroy, J.B., Sr.

The VAX 9000 achieves its high performance through the use of high-speed hardware and architectural features that reduce both cycle time and cycles per instruction execution. The multi chip unit (MCU), the heart of the high-density packaging approach which makes the fast cycle time possible, is described. The performance analysis that led to the selection of this packaging technology is reviewed. This is followed by a brief description of the semiconductors and an overview of the MCU, its components, and their performance. The VAX 9000 logic is based on the Motorola MCAIII emitter-coupled-logic gate array technology. Housing and connector features are briefly examined.<>

Published in:

Compcon Spring '90. Intellectual Leverage. Digest of Papers. Thirty-Fifth IEEE Computer Society International Conference.

Date of Conference:

Feb. 26 1990-March 2 1990

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