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One of the solution for improving the environmental performance of the products is elongation of products life time and getting their higher reliability by applying different additives. The purpose of our work was to investigate the influence of modified carbon nanotubes addition to solder paste on the solder joints properties and their thermal and mechanical fatigue. In the investigation, to the basic solder paste contains the commercial SAC 305 alloy were added the 0.01, 0.05 or 0.1 wt. % of the self-modified CNT. After the pastes had stabilized, the basic properties of the pastes like slump, solder ball, wetting were performed. Next, after reflow soldering process of “zero ohm” chip resistors on PCBs with SAC (HAL) and Ni/Au finishes the mechanical and microstructure properties of the solder joints were investigated. Finally, the cyclic bending strength and thermo-shock methods were used to define of thermal and mechanical fatigue of the solder joints.