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A hybrid substrate integrated waveguide (SIW) interconnect composed of a baseband and a bandpass structure sharing the same physical area is implemented using a flexible substrate. This interconnect, which is aimed for chip-to-chip ultra-high-speed multichannel data communication, has been studied by measuring its S-parameters and time domain system performance. The fabricated hybrid SIW was subjected to various bending angles and the impact on signal integrity was observed by monitoring the output eye diagrams as well as reflection and transmission coefficients. System performance was measured with the data rate of 3.125 Gbit/s channel for both baseband and bandpass channels, which shows excellent quality eye diagrams for each channel.