By Topic

Investigation of Resistivity Variation of Printed Circuit Board Laminates Due to Aging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Bulletti, A. ; Dipt. Elettron. e Telecomun., Univ. degli Studi di Firenze, Florence, Italy ; Capineri, L. ; Dunn, B.D. ; Bruzzi, M.

The scope of this paper is the characterization of the variation of surface and volume resistivities of printed circuit board (PCB) laminates, such as standard epoxy, polyimide, and Thermount, when subjected to different aging tests relevant for harsh environment electronic applications as in avionic, space, defense, high-energy physics, and clinical radiotherapy. In fact, in all of these applications, the PCBs are subjected to energetic sources of various nature and high-dose levels, which can produce relevant aging, possibly modifying their dielectric characteristics. Conditioning processes related to irradiation considered in this paper are: 1) the exposure to an ultraviolet source; 2) irradiation with a 297-keV electron beam; and 3) relative humidity (RH) tests at room temperature (20°C at 50% RH and at 20°C at 90% RH), which are performed to take into account another important environmental factor that can affect dielectric characteristics through absorption with long exposure time (20 days). The experimental procedure adopted in this paper considers a total number of 30 samples to assess the mean value and variance of each surface and volume resistivity measurement.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 12 )