A CMOS integrated, surface micromachined angular rate sensor utilizing an electroformed vibrating metal ring structure on a silicon IC has been developed. Substantial signal conditioning circuitry may be included on the IC with the vibrating structure. Tests of the sensor demonstrate that its performance is equivalent to that required for a variety of automotive angular rate applications
Published in:
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
(Volume:2
)
Date of Conference: 16-19 Jun 1997